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Your search returned 15 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Packaging And Manufacturing Technology Part A
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Year : 1998 Volume number : 21 Issue: 03 |
A Thermal Benchmark Chip Design And Applications
(Article)
Subject:
Chip Temperature Gradient
,
Thermal Mapping
,
Thermal Transpiration
Author:
Vladimir
Szekely
Csaba
Marta
Zsolt
Benedek
page:
399
-
405
Chatacterization Of Self-Heating In Advanced Vlsi Interconnect Lines Based On Thermal Finite Element Simulation
(Article)
Subject:
Advanced Vehicular Speed Adaptation System
,
Design Rules
,
Fem
Author:
K.
Banerjee
Sven
Rzepka
Chenming
Hu
page:
406
-
411
Adaptive Modeling Of The Transients Of Submicron Integrated Circuits
(Article)
Subject:
Transient Modeling
,
Three-Dimensional Cad
,
Dynamic Relaxation
Author:
Peter. E
Raad
James H
Wilson
Donald C.
Price
page:
412
-
417
Propagation Analysis For Thermal Modeling
(Article)
Subject:
Electrical Networks
,
Electromagnetic Analysis
,
Transmission Loss
Author:
Donard De
Cogan
page:
418
-
423
Thermal Parameters Measurement Method Of Electronics Materials
(Article)
Subject:
Effusivity
,
Photoacoustics Lands
,
Thermal Diffusion
,
Thermal Wave
Author:
Zbigniew
Suszynski
Leszek
Bychto
page:
424
-
433
Photothermal Examination Of Adhesion In Semiconductor Devices
(Article)
Subject:
Adhesion
,
Galvanic Coatings
,
Thermal Wave
Author:
Zbigniew
Suszynski
page:
434
-
440
Radiative Properties Of Smiox
(Article)
Subject:
Emissivity
,
Temperature Measurement
,
Radiative Properties
Author:
Nuggehalli M.
Ravindra
Rajasekhar
Velagapudi
page:
441
-
449
High Performance No-Flow Underfillsfor Low-Cost Flip-Chip Application Material Characterization
(Article)
Subject:
Catalyst
,
Flip-Chip
,
No-Flow Underfill
Author:
C. P.
Wong
Songhua H.
Shi
G.
Jefferson
page:
450
-
458
Puckaging Factors Affecting The Fatigue Life Of Power Transistor Die Bonds
(Article)
Subject:
Die Bond
,
Fatigue
,
Packaging
,
Power Tracing Method
Author:
John
Evans
Jilian Y.
Evans
page:
459
-
468
Conductive Adhesives For High-Frequency Applications
(Article)
Subject:
Aca
,
Fr-4
,
Sem
Author:
Rolf
Sihlbom
Zonghe
Lai
Johan
Liu
page:
469
-
477
High Frequency Measurements And Simulations On Wire-Bonded Modules On The Sequential Build-Up Boaard Sbu'S
(Article)
Subject:
Cross Talk (Ctk)
,
Fr-4
,
Impedance Matching
Author:
Rolf
Sihlbom
Markus
Dernevik
page:
478
-
491
Development Of Large-Area Batio Ceramics With Optimized Depletion Regions As Dielectrics For Planar Power Electeronics
(Article)
Subject:
Ceramic Anode
,
Large Area Planar Dielectrics
Author:
Colin K.
Campbell
Max Frederich
Karl Holm
page:
492
-
499
Effect Of Surface Reactivity Of Lubricants On The Properties Of Aluminum Electrical Contacts
(Article)
Subject:
Author:
Roland S.
Timsit
N. E.
Corman
E. M.
Bock
page:
500
-
505
Precision Measurement And Mapping Of Die-Attach Thermal Resistance
(Article)
Subject:
Thermal Resistance
,
Packaging
,
Electrical Resistivity Tomography (Ert)
Author:
Katsuo
Kurabayashi
Kenneth E.
Goodson
page:
506
-
514
A Novel Lightweight Microwave Packaging Technology
(Article)
Subject:
Aluminum
,
Structures
,
Silicon
Author:
David M.
Jaconson
Satti P. S.
Sangha
page:
515
-
523
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